舒文皓, 高芳清, 李晨现. 某机载PCB动态特性等效建模分析及实验验证[J]. 机械研究与应用, 2023, 36(6): 1-4. DOI: 10.16576/j.ISSN.1007-4414.2023.06.001
引用本文: 舒文皓, 高芳清, 李晨现. 某机载PCB动态特性等效建模分析及实验验证[J]. 机械研究与应用, 2023, 36(6): 1-4. DOI: 10.16576/j.ISSN.1007-4414.2023.06.001
SHU Wen-hao, GAO Fang-qing, LI Chen-xian. Equivalent Simulation Modeling Analysis on the Dynamic Characteristics of Airborne PCB[J]. Mechanical Research & Application, 2023, 36(6): 1-4. DOI: 10.16576/j.ISSN.1007-4414.2023.06.001
Citation: SHU Wen-hao, GAO Fang-qing, LI Chen-xian. Equivalent Simulation Modeling Analysis on the Dynamic Characteristics of Airborne PCB[J]. Mechanical Research & Application, 2023, 36(6): 1-4. DOI: 10.16576/j.ISSN.1007-4414.2023.06.001

某机载PCB动态特性等效建模分析及实验验证

Equivalent Simulation Modeling Analysis on the Dynamic Characteristics of Airborne PCB

  • 摘要: 针对某机载PCB上元器件的分布以及其结构特点,提出一种基于元器件局部质量刚度等效的PCB动态特性等效建模方法。该方法以PCB基板的原始几何尺寸为基础,将元器件的刚度和质量等效地应用到基板和元器件的连接处,以模拟实际PCB上元器件对整体基板的影响。通过模态试验得到PCB基板和等效建模区域的杨氏模量和泊松比,然后将得到的等效模型用于有限元仿真,计算获得等效模型的模态频率和振型。最后将仿真结果与模态试验结果进行对比,以验证等效建模方法的可行性。结果表明,该等效建模方法在工程需求上满足要求,为以后类似的PCB产品快速等效建模以及获取动态特性提供了借鉴思路。

     

    Abstract: According to the distribution and structural characteristics of components on an airborne PCB, an equivalent modeling method of PCB dynamic characteristics based on the local mass stiffness equivalence of components is proposed. This method is based on the original geometric dimensions of the PCB substrate. The stiffness and mass of the components are equivalent to the connection between the substrate and the components to equivalent the impact of the components on the overall substrate on the actual PCB. Based on the modal test, the Young's modulus and Poisson's ratio of the PCB substrate and the equivalent modeling area are obtained. Then the obtained equivalent model is used in the finite element simulation to calculate the modal frequency and mode shape of the numerical calculation of the equivalent model; and the results are compared with the modal test results. The results show that the equivalent modeling method meets the engineering requirements, and it provides a reference idea for rapid equivalent modeling to obtain dynamic characteristics of the similar PCB products in the future.

     

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