Abstract: Liquid cooling technology has gradually become the first choice of heat dissipation technology for airborne electronic equipment due to the advantages of high heat transfer coefficient, strong mobility and stable operation. This paper introduces the application of side-wall and through-wall liquid-cooling technologies commonly used in airborne electronic equipment, and summarizes the existing problems. Subsequently, the basic principles of liquid cooling technologies such as microchannel, spray cooling and jet cooling are comprehensively elaborated, as well as the current research status; and the advantages and disadvantages of each technology application are summarized in detail. Finally, suggestions for further in-depth research on liquid cooling technology for airborne electronic equipment are put forward.