Abstract: As a highly integrated electronic device, a face recognition attendance machine is prone to elevated temperatures in its internal main control chip during long-term operation, which in turn impairs recognition accuracy and service life. This paper investigates the thermal issues of face recognition attendance machines through heat source analysis and thermal simulation modeling. First, a three-dimensional model is established using SolidWorks to analyze the heat generation characteristics of the main control chip, camera module, and power supply unit, followed by temperature simulation of each internal module via ANSYS Icepak. Second, a thermal dissipation scheme based on optimized air ducts and aluminum alloy material is proposed, and its performance is compared with natural convection and PC material. Simulation results show that the optimized thermal structure reduces the main control chip temperature by 13.9% with only an 8% increase in cost, significantly improving equipment stability. The research provides a theoretical basis and simulation reference for the thermal design of low-cost compact electronic devices.