Abstract: With the increase of the customization requirements of airborne computer modules, the differences in size and power consumption of different modules are becoming more and more obvious. In the face of the heat dissipation requirements of different modules, the use of a single heat dissipation technology will inevitably lead to insufficient heat dissipation capacity or excess heat dissipation capacity. In this paper, the traditional through-wall liquid cooling and sidewall liquid cooling technology are combined to form a new through-sidewall integrated liquid cooling technology. The thermal simulation software is used to analyze the thermal simulation of various design schemes, which verifies the excellence of the schemes and accumulates experience for the subsequent design of airborne chassis.