Abstract: Polyetheretherketone has good insulation and certain thermal conductivity, and is a feasible material for manufacturing insulated radiators. However, its low intrinsic thermal conductivity limits its direct application. In this paper, the heat dissipation capacity of polyetheretherketone radiator is improved by structural bionic design. Four kinds of bionic structure chip radiators are designed. Based on ANSYS Workbench, the thermal simulation is completed and the optimal bionic structure is selected. Compared with the aluminum alloy fin radiator with the same shape and size, the simulation results show that the maximum temperature of the polyetheretherketone bionic radiator is 14.4 ℃ higher than that of the aluminum alloy fin radiator. The minimum temperature of the radiator is 4.3 ℃ lower and the average temperature is 0.76 ℃ lower. The infrared thermal imaging experiment verifies the accuracy of the simulation results. Through the structural bionic design, the heat dissipation performance gap between the polyetheretherketone bionic radiator and the aluminum alloy fin radiator is significantly reduced, and can meet the normal use requirements. This paper provides a new method reference for solving the problem of heat dissipation and insulation of electronic devices.