Simulation of QFP Solder Joint Geometry and Random Vibration Fatigue Life Prediction

Aiming at the vibration reliability problem of airfoil solder joints in electronic equipment, the general method of simulation analysis for the solder joints of electronic equipment components under random vibration load is introduced. The Surface Evolver software is used to obtain the shape prediction model of solder joints of an airborne electronic device. The finite element model is built by importing Hypermesh into ABAQUS finite element software. Random vibration loads are added to the model in finite element software, and then the Steinberg model is adopted to obtain the reliability life of solder joints under the random vibration loads by combining the Manson's high cycle fatigue empirical formula with the Palmgren-Miner's linear fatigue damage accumulation criterion. The research results have practical value for failure analysis of solder joints of electronic equipment components.