Design and Experimental Study of Main Circuit and Heat Dissipation Structure of Low Voltage and High Current Driver

In order to meet the reliability of an aviation low voltage and high current driver (bus voltage 28 V, bus current 220 A), this paper optimizes the selection of bus support capacitors in the main circuit of the driver, in order to reduce the parasitic inductance of the main circuit as much as possible and reduce the voltage stress impact on the power device. In addition, in order to ensure that the whole system runs under rated conditions for a long time, the junction temperature of the power device is within a reasonable range, and the cooling device of the system is also redesigned. Based on the above two points, the main loop and structure of the system are optimized in this paper, and the thermal properties of the controller are simulated and verified by experiments. The results show that the simulation results can well reflect the actual loss, and the device temperature rise is effectively controlled.