The Finite Element Analysis of the Support Structure for TFT-LCD Oven Glass Substrates

Concerning the optimization problem of the glass substrate support structure in the curing oven of the 8.5th generation TFT-LCD production line, this paper focuses on the influence of support spacing on the deformation and stress of glass substrate at room temperature, establishes a three-dimensional parametric finite element model by using ANSYS Workbench, and systematically studies the static response of four working conditions of support ejector pin spacing of 200 mm, 250 mm, 300 mm and 350 mm. As an important support part of the glass substrate in the drying equipment, the parameters of the support have a significant impact on the Von-Mises stress and deformation of the glass. The results show that the maximum total deformation and maximum Von-Mises stress are distributed in a “shallow bowl” shape under the specific glass substrate thickness and dead weight. In the range of 200−350 mm support spacing, the influence of support spacing on the structural response is limited, and the change range of deformation and stress is not more than 3.2%. The maximum deformation is located in the outer span of the glass substrate, and the maximum stress occurs at the contact edge between the supporting thimble and the glass substrate.